Online SPI 3D PCBA Solder Paste Inspection MH310

Online SPI 3D PCBA Solder Paste Inspection MH310

Description:

The 3D measurement of precision printed solder paste is realized by using phase modulation contour measurement technology quantity, while ensuring the high-s[eed measurement, greatly improves the measurement accuracy.

Core Advantage:

1, Alintelligent algorithm, one click search and positioning, programming is fast and simple.

2, It can cooperate with the printing press to achieve the closed loop function.

3, Realize real-time SPC monitoring and analysis.

4, Three pint according.

5, Bad board flight identification function and the sharing function of badmark points.

6, Support panel graphics storage.

The phase modulation contour measurement technology is used to realize the 3D measurement of the precision printing solder paste, which greatly imporves the measurement accuracy while ensuring the high-speed measurement.

Phase modulation contour measurement technology (PMP), known as phase shift contour technique(PSP for short), is based on the sinusoial structure grating prjection, discrete phase shift to obtain multiple deformed light field images, and then calculate the phase distribution according to the multi-step phase shift method, and finnaly the high precision volume measurement results are obtained by geometric methods such as triangulation.