|
| MOQ: | 1pcs |
| Standard Packaging: | Paper pack |
| Delivery Period: | within 1~5days |
| Payment Method: | T/T, Western Union, MoneyGram |
| Supply Capacity: | 100000pcs |
Online Laser Depaneling Machine SMT Equipment Model S4 Series Laser Splitting Machine
1.Three-stage rail transfer
2.Compact structure,solid and stabie
3.Collocation with a variety of lasers
4.Contact-free processing
5.Clean and dust-free
6.Direct data driven
7.High efficiency and high precision
8.Automation
9.Easy operation and maintenance
Laser cutting advantages
1.Non-contact No mechanical stress and deformation
2.Wide adaptability Can process and complex graphics compatible with a variety of materials
3.Environment-friendly Less dust,high efficiency and energy saving
4.High-accuracy Narrow cut joint and low thermal impact
Application objects
1.High precision fast full cutting,breakpoint cutting partition for PCBA hard shape;rigid-flexible combined circyit board shape cutting
Laser cutting application
1.Application fields;semiconductors.integrated circuits communication lighting,etc
2.Application object;LCP,MPI,PI,FR4,FR5 and CEMand polyestey,ceramic and other rf materials
|
|
| MOQ: | 1pcs |
| Standard Packaging: | Paper pack |
| Delivery Period: | within 1~5days |
| Payment Method: | T/T, Western Union, MoneyGram |
| Supply Capacity: | 100000pcs |
Online Laser Depaneling Machine SMT Equipment Model S4 Series Laser Splitting Machine
1.Three-stage rail transfer
2.Compact structure,solid and stabie
3.Collocation with a variety of lasers
4.Contact-free processing
5.Clean and dust-free
6.Direct data driven
7.High efficiency and high precision
8.Automation
9.Easy operation and maintenance
Laser cutting advantages
1.Non-contact No mechanical stress and deformation
2.Wide adaptability Can process and complex graphics compatible with a variety of materials
3.Environment-friendly Less dust,high efficiency and energy saving
4.High-accuracy Narrow cut joint and low thermal impact
Application objects
1.High precision fast full cutting,breakpoint cutting partition for PCBA hard shape;rigid-flexible combined circyit board shape cutting
Laser cutting application
1.Application fields;semiconductors.integrated circuits communication lighting,etc
2.Application object;LCP,MPI,PI,FR4,FR5 and CEMand polyestey,ceramic and other rf materials
