|
| MOQ: | 1pcs |
| Standard Packaging: | Paper pack |
| Delivery Period: | within 1~5days |
| Payment Method: | T/T, Western Union, MoneyGram |
| Supply Capacity: | 100000pcs |
AI 2D AOI True 3D+AI detects all defects at one time SMT Equipment
1.Multi-angle light source with high resolution camera and telecentric lens,greatly improve the detection effect
2.High-precision motion system ensures precise positioning during high-speed movements
3.Silkscreen lnteference Removal Algorithm,Alignment Correction due to Silkcreen lnterfrence Removal
4.Connect and integrate MES system according to factory requirements
5.Powerful SPC software to provide rich and accurate statistics
6.Integrated casting,high-rigidity platform
Common Defects
1.BIllboarding 2.Short circuit 3.Extra component 4.Excess sikder
5.No solder 6.Tombstoning 7.Tombstoning 8.Print leakage
9.Offset 10.Rotation 11.Insufficient solder 12.Foreign material
AI Detectable Defects
|
|
| MOQ: | 1pcs |
| Standard Packaging: | Paper pack |
| Delivery Period: | within 1~5days |
| Payment Method: | T/T, Western Union, MoneyGram |
| Supply Capacity: | 100000pcs |
AI 2D AOI True 3D+AI detects all defects at one time SMT Equipment
1.Multi-angle light source with high resolution camera and telecentric lens,greatly improve the detection effect
2.High-precision motion system ensures precise positioning during high-speed movements
3.Silkscreen lnteference Removal Algorithm,Alignment Correction due to Silkcreen lnterfrence Removal
4.Connect and integrate MES system according to factory requirements
5.Powerful SPC software to provide rich and accurate statistics
6.Integrated casting,high-rigidity platform
Common Defects
1.BIllboarding 2.Short circuit 3.Extra component 4.Excess sikder
5.No solder 6.Tombstoning 7.Tombstoning 8.Print leakage
9.Offset 10.Rotation 11.Insufficient solder 12.Foreign material
AI Detectable Defects
