|
| MOQ: | 1pcs |
| Standard Packaging: | Paper pack |
| Delivery Period: | within 1~5days |
| Payment Method: | T/T, Western Union, MoneyGram |
| Supply Capacity: | 100000pcs |
AI 3D SPI True 3D+AI detects all defects at one time SMT Equipment
1.The latest self-developed AAM absolute precision measuring system,accurate detection of poor pad printing of 0201 mm components.
2.High-precision automatic Z-axis module, capable of adapting to various complex processes
3.Can be integrated with MES according to factory requirements.
4.Prweful SPC software provides rich and accurate data statistics.
5.Integrated casting,high-rigidity platforrm
True 3D Detection
Small angle 2-way projection system,eliminate small spacing occlusion to a greater extent
Breakthrough Morie fringe algorithm to further reduce CT time
3D Inspection effect
Common defects
1.Excess solder 2.Print leakage 3.Skew 4.Short circuit
5.Short circuit 6.Insufficient solder 7Irregular soledr paste 8.Odd-shaped
AI Detectable defects
1.Gold surface scratch 2.Gold surface contamination 3.Excess solder
4.Copper Leakage 5.Qxidation 6.Foreign material
|
|
| MOQ: | 1pcs |
| Standard Packaging: | Paper pack |
| Delivery Period: | within 1~5days |
| Payment Method: | T/T, Western Union, MoneyGram |
| Supply Capacity: | 100000pcs |
AI 3D SPI True 3D+AI detects all defects at one time SMT Equipment
1.The latest self-developed AAM absolute precision measuring system,accurate detection of poor pad printing of 0201 mm components.
2.High-precision automatic Z-axis module, capable of adapting to various complex processes
3.Can be integrated with MES according to factory requirements.
4.Prweful SPC software provides rich and accurate data statistics.
5.Integrated casting,high-rigidity platforrm
True 3D Detection
Small angle 2-way projection system,eliminate small spacing occlusion to a greater extent
Breakthrough Morie fringe algorithm to further reduce CT time
3D Inspection effect
Common defects
1.Excess solder 2.Print leakage 3.Skew 4.Short circuit
5.Short circuit 6.Insufficient solder 7Irregular soledr paste 8.Odd-shaped
AI Detectable defects
1.Gold surface scratch 2.Gold surface contamination 3.Excess solder
4.Copper Leakage 5.Qxidation 6.Foreign material
