|
| MOQ: | 1pcs |
| Standard Packaging: | Paper pack |
| Delivery Period: | within 1~5days |
| Payment Method: | T/T, Western Union, MoneyGram |
| Supply Capacity: | 100000pcs |
Wire bonding inspection equipment SMT Equipment WEBER 3D AOI
Equipment Characteristics
1.High-density marble platform provides assurance for high-precision
2.Multi-angle light sources combined with high-resolution cameras and telecentric lenses greatly enhance detection results
3.The latest self-developed AAM absolute precision measurement system,accurately detects wire aluminum and wire bonding defects
AI Detection System
Trainning images}}AI deep neural network}}AI model}}Test results
^^^
Products to be inspected
3D Detectlon
1.Having complete WB 3D imaging capability
2.Multi-layer focusing function,infinite depth of field,clear imaging across the entire board
3.Zero-negative sample AI detection,exclusive in the industry,complex appearance defect capability
EQUIPMENT PARAMETERS
| Model | WB-3D | |
| Vision system | Camera | Standara:1200w;Optional:2100W/6500W |
| Resolution | 2.7μm/1.8μm | |
| FOV size | 11mm*8.25mm | |
| IIIumination | RGBW LED | |
| Hardware | Power Supply | 200V-230V AC50/60Hz |
| Power | 2.2KW | |
| Pressure | 0.4-0.6MPa | |
| Weight | 1100kg | |
| Equipment size | W1156*D1475*H1650 | |
| Check specifications | Substrate size | 50*50~510*460mm |
| PCB thickness | 0.6~6mm | |
| Measure height | Components measurable up to a maximum height of 30mm | |
| Optional function | Artificial intelligence | ALBig Data Training Center |
| Auxiliary function | Remote centralized review,Barcode reading,OCR recognition | |
| Inspection items | Appearance inspection | Bad wire arc,bad solder joints,oxidation pollution,foreign matter,scratches...... |
|
|
| MOQ: | 1pcs |
| Standard Packaging: | Paper pack |
| Delivery Period: | within 1~5days |
| Payment Method: | T/T, Western Union, MoneyGram |
| Supply Capacity: | 100000pcs |
Wire bonding inspection equipment SMT Equipment WEBER 3D AOI
Equipment Characteristics
1.High-density marble platform provides assurance for high-precision
2.Multi-angle light sources combined with high-resolution cameras and telecentric lenses greatly enhance detection results
3.The latest self-developed AAM absolute precision measurement system,accurately detects wire aluminum and wire bonding defects
AI Detection System
Trainning images}}AI deep neural network}}AI model}}Test results
^^^
Products to be inspected
3D Detectlon
1.Having complete WB 3D imaging capability
2.Multi-layer focusing function,infinite depth of field,clear imaging across the entire board
3.Zero-negative sample AI detection,exclusive in the industry,complex appearance defect capability
EQUIPMENT PARAMETERS
| Model | WB-3D | |
| Vision system | Camera | Standara:1200w;Optional:2100W/6500W |
| Resolution | 2.7μm/1.8μm | |
| FOV size | 11mm*8.25mm | |
| IIIumination | RGBW LED | |
| Hardware | Power Supply | 200V-230V AC50/60Hz |
| Power | 2.2KW | |
| Pressure | 0.4-0.6MPa | |
| Weight | 1100kg | |
| Equipment size | W1156*D1475*H1650 | |
| Check specifications | Substrate size | 50*50~510*460mm |
| PCB thickness | 0.6~6mm | |
| Measure height | Components measurable up to a maximum height of 30mm | |
| Optional function | Artificial intelligence | ALBig Data Training Center |
| Auxiliary function | Remote centralized review,Barcode reading,OCR recognition | |
| Inspection items | Appearance inspection | Bad wire arc,bad solder joints,oxidation pollution,foreign matter,scratches...... |
