Wire Bonding Inspection Equipment WB-3D SMT Equipment WEBER 3D AOI

Wire bonding inspection equipment SMT Equipment WEBER 3D AOI

Equipment Characteristics
1.High-density marble platform provides assurance for high-precision
2.Multi-angle light sources combined with high-resolution cameras and telecentric lenses greatly enhance detection results
3.The latest self-developed AAM absolute precision measurement system,accurately detects wire aluminum and wire bonding defects
AI Detection System
Trainning images}}AI deep neural network}}AI model}}Test results
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                                                            Products to be inspected
3D Detectlon
1.Having complete WB 3D imaging capability
2.Multi-layer focusing function,infinite depth of field,clear imaging across the entire board
3.Zero-negative sample AI detection,exclusive in the industry,complex appearance defect capability

EQUIPMENT PARAMETERS