Home ProductsSMT Spare Parts

K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts

K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts

  • K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts
  • K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts
  • K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts
K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts
Product Details:
Place of Origin: Korean
Brand Name: Samsung
Model Number: K9F4G08U0D-SIB0
Payment & Shipping Terms:
Minimum Order Quantity: 1pcs
Delivery Time: within 3days
Payment Terms: T/T, Western Union, MoneyGram
Supply Ability: 1000pcs
Contact Now
Detailed Product Description
Part Name: Chip Component Model: K9F4G08U0D-SIB0
Condition: Original New Brand: Samsung
Origin: Korean Location: Shenzhen
High Light:

smt parts

,

smt machine parts

,

K9F4G08U0D-SIB0 Samsung Chip

K9F4G08U0D-SIB0 Samsung Chip Component Assembled

 

Detail Information:

1, Part Name: Chip Component

2, Model:K9F4G08U0D-SIB0 

3, Brand: Samsung

4, Condition: Original New

5, Origin: Korean

K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts 0

  • Manufacturer Part Number:

    K9F4G08U0D-SIB0000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    12 X 20 MM, 0.50 MM PITCH, HALOGEN AND LEAD FREE, PLASTIC, TSOP1-48

  • Manufacturer:

    Samsung Semiconductor

  • Risk Rank:

    5.84

  • Access Time-Max:

    25 ns

  • Command User Interface:

    YES

  • Data Polling:

    NO

  • JESD-30 Code:

    R-PDSO-G48

  • Length:

    18.4 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Sectors/Size:

    4K

  • Number of Terminals:

    48

  • Number of Words:

    536870912 words

  • Number of Words Code:

    512000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Equivalence Code:

    TSSOP48,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Page Size:

    2K words

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Supplies:

    3/3.3 V

  • Programming Voltage:

    3.3 V

  • Qualification Status:

    Not Qualified

  • Ready/Busy:

    YES

  • Seated Height-Max:

    1.2 mm

  • Sector Size:

    128K

  • Standby Current-Max:

    0.00005 A

  • Subcategory:

    Flash Memories

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Toggle Bit:

    NO

  • Type:

    NAND TYPE

  • Width:

    12 mm

Contact Details
Dongguan Kingfei Technology Co.,Limited

Contact Person: Sandy

Tel: +8617324492760

Send your inquiry directly to us
Best Products
Other Products
.