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|Part Name:||X5 Reflow Profiler||Model:||X5|
KIC X5 Thermal Profiler with SPC software and RF capability For Reflow
With 7, 9, and 12-channel models, the X5 is able to acquire a lot of data, allowing you to precisely evaluate each thermal profile and process in your factory. Measure slope, peak temperature, time above liquidous, and more. Data is transferred to your computer via a USB cable or, for RF models, wirelessly through radio frequency transmitters—no cable connection required.
A lot of data means nothing without a way to parse it. The powerful SPC charting software that comes with the X5 helps improve production quality, productivity, and documentation over time by allowing operators to spot and correct process drift before it results in defects and yield issues. The collected data can also be analyzed with an eye toward overall process improvement.
In addition to helping to improve process in general, the X5 makes it easy to set up new profiles. Process improvement and optimization is automated with the X5, thanks to the included Navigator Power™ software. Navigator Power is able to identify the best oven setup in mere seconds, based on basic optimization criteria selected by the user. Users are quickly and intuitively guided through profiling, and a Process Window Index™ (PWI) lets operators know at a glance how “in spec” a given profile is—the lower the PWI number, the more centered the profile is within the process window. Finally, manual prediction capability allows users to instantly view expected results to changes in the profile.
Featuring new improvements in hardware, the X5 thermal profiler from KIC is designed to withstand daily use in the toughest production environments, a claim that’s backed up by the profiler's two-year warranty. The new design also addresses the voltage spikes that can occur in some ovens and wave soldering machines with updated electronic circuitry that is more tolerant of these conditions.
The KIC Navigator software included with the X5 makes it possible to optimize oven setup even for strict process requirements, ensuring maximum product throughput, better equipment utilization and more efficient staff allocation.
KIC’s powerful Navigator™ software is a system that automatically determines the single best oven recipe for every product. Once the initial profile is run, the Navigator evaluates billions of combinations of conveyor speeds and setpoint temperatures in less than a minute, so operators no longer need to set search parameters.
You give the Navigator your profile specs, and the Navigator presents the process set up that will produce a profile centered in the process window, with the lowest Process Window Index™ (PWI). With the Navigator, an operator with limited process knowledge can find the optimal profile every time.
Whether it takes you two runs to set up a simple profile, or 5 runs for a difficult one, why spend the time? The Navigator finds the best possible profile in less than 60 seconds. This means more efficient use of the engineering resources, increased line uptime, and improved line uptime - which all mean an improved bottom line.
Without the power of the Navigator, solder reflow oven setpoint changes are typically made in 5°C increments. Research made possible by the Process Window Index shows that setting up the oven in smaller increments offers significantly improved process performance. Extensive testing revealed substantial benefits in setting up profiles in 1°C increments. Slight setpoint changes in the soak and reflow zones produced more robust profiles that reduced temperatures at hot spots on the board and provided more even heating across the assembly. Precision profiling also makes developing tight-spec lead-free profiles as quick and easy as any other profile with the Navigator.
Minimum System Requirements
|KIC 'X5' - Specifications|
|Dimensions (L x W x H)||7-channel
206 x 60 x 17 mm (8.1" x 2.4" x 0.7")
With shield: 302 x 75 x 23 mm (11.9" x 3" x 0.9")
206 x 75 x 17 mm (8.1" x 3" x 0.7")
With shield: 312 x 90 x 23 mm (12.3" x 3.5" x 0.9"
206 x 98 x 17 mm (8.1" x 3.9" x 0.7")
With shield: 323 x 113 x 23 mm (12.7" x 4.4" x 0.9"
|Internal Operating Temp.||0˚C to 85˚C|
|Sample Rate||0.1 to 10 readings/sec|
|Data Transfer||Standard model
USB 2.0 (Std-A/Mini-B) after datalogging run
Wireless over RF (radio frequency 433.92 MHz), sent real-time during datalogging run, or via USB 2.0 (Std-A/Mini-B) after datalogging run
|Power Requirements||3 AAA batteries, USB cable when connected to a computer|
|Thermocouple Capacity||Type K, standard (7, 9, or 12, depending on model)|
|Thermocouple Temperature Range||-150˚C to 1050˚C|
|Thermal Shield||Cool Touch Stainless Steel 7 or 9 channel|
Minimum System Requirements
Dual Core / 1 GHz processor PC w/2 GB RAM