|
| MOQ: | 1pcs |
| Standard Packaging: | Paper pack |
| Delivery Period: | within 1~5days |
| Payment Method: | T/T, Western Union, MoneyGram |
| Supply Capacity: | 100000pcs |
Double-sided wave soldering 2D/3D AOI SMT Equipment 2D/3D AOI
1.PCB top and bottom detecton,simplify the manufacturing process,reduce the factory labor and equipment costs
2.Solder plate positioning,FOV positioning with AI algorithm automatic programming to simplify the process and debugging,powerful solder joint inspection ability
3.Equipped with optical fiber beam sensor and side stop cylinder can accurately stop the board,equipped with more stable side grab pressure board best
4.Dual camera synchronous position,asynchronous interlock take image to avoid up and down light source interference
Common Defects
1.Billboarding 2.Short circuit 3.Extra component 4.Print leakage 5.Insufficient solder
6.No solder 7.Tombstoning 8.Excess solder 9.Foreign material 10.Offset
DIP Defects DIP
1.Insufficient solder 2.Excess solder 3.Solder hole 4.Solder joint
5.Unavailabie pin 6.PIN deformation 7.Foreign material 8.Unavailabie pin
AOI Highlights
Component level pad positioning+DIP special AI algorithm ,support one key setting of the same type of parameters
Due to the large number of DIP solder joints,this feature greatly simplifies program optimization and debugging time
|
|
| MOQ: | 1pcs |
| Standard Packaging: | Paper pack |
| Delivery Period: | within 1~5days |
| Payment Method: | T/T, Western Union, MoneyGram |
| Supply Capacity: | 100000pcs |
Double-sided wave soldering 2D/3D AOI SMT Equipment 2D/3D AOI
1.PCB top and bottom detecton,simplify the manufacturing process,reduce the factory labor and equipment costs
2.Solder plate positioning,FOV positioning with AI algorithm automatic programming to simplify the process and debugging,powerful solder joint inspection ability
3.Equipped with optical fiber beam sensor and side stop cylinder can accurately stop the board,equipped with more stable side grab pressure board best
4.Dual camera synchronous position,asynchronous interlock take image to avoid up and down light source interference
Common Defects
1.Billboarding 2.Short circuit 3.Extra component 4.Print leakage 5.Insufficient solder
6.No solder 7.Tombstoning 8.Excess solder 9.Foreign material 10.Offset
DIP Defects DIP
1.Insufficient solder 2.Excess solder 3.Solder hole 4.Solder joint
5.Unavailabie pin 6.PIN deformation 7.Foreign material 8.Unavailabie pin
AOI Highlights
Component level pad positioning+DIP special AI algorithm ,support one key setting of the same type of parameters
Due to the large number of DIP solder joints,this feature greatly simplifies program optimization and debugging time
